If you are in need of NSN parts such as WS57C256F-70DMB, look no further than Aerospace Store. Owned and operated by ASAP Semiconductor, a leading aerospace and defense distributor, Aerospace Store has access to an inventory of more than two billion new and obsolete parts including Microcircuit Memory and much more.
Anything not in our inventory can be found through our international supply chain network that spans the United States. Additionally, Aerospace Store upholds a strict no China sourcing policy, guaranteeing that each part you buy from us is fully traceable or comes directly from a trusted manufacturer like Waferscale Integration Inc.
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Each of our NSN 5962013897020 parts like WS57C256F-70DMB by Waferscale Integration Inc is readily available with short lead times and competitive prices. Aerospace Store boasts a broad selection of in-demand parts from manufacturers such as Waferscale Integration Inc and others. To get in touch with a dedicated account manager, simply submit an RFQ. To do this, enter the part number you want, the quantity needed, and when you need the parts by.
After this, enter some basic contact information and submit. Our team of account managers is standing by and will respond to all RFQ’s in 15 minutes or less.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-389-7020 Item Description: Microcircuit Memory | 5962 | 013897020 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | isc | rnvc | rncc | HCC | MSDS | SADC |
| Ws57c256f-70dmb | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 37.85 MILLIMETERS MAXIMUM" |
| ADAT | BODY WIDTH | 12.70 MILLIMETERS MINIMUM AND 15.49 MILLIMETERS MAXIMUM" |
| ADAU | BODY HEIGHT | 4.40 MILLIMETERS MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED AND ULTRAVIOLET ERASABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM INPUT DRIVE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 14.0 VOLTS NOMINAL TOTAL SUPPLY" |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS" |
| CZER | MEMORY DEVICE TYPE | EPROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT" |
| ADAQ | BODY LENGTH | 37.85 MILLIMETERS MAXIMUM" |
| ADAT | BODY WIDTH | 12.70 MILLIMETERS MINIMUM AND 15.49 MILLIMETERS MAXIMUM" |
| ADAU | BODY HEIGHT | 4.40 MILLIMETERS MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED AND ULTRAVIOLET ERASABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM INPUT DRIVE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 14.0 VOLTS NOMINAL TOTAL SUPPLY" |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS" |
| CZER | MEMORY DEVICE TYPE | EPROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT" |
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